Lead-Free Initiative

As a supplier to the military and aerospace industry worldwide, Micross Components acknowledges the current direction of the industry to transition into a lead-free manufacturing process in accordance with EU-Directive 2002/95/EG ("Restriction of Hazardous Substances"/ROHS).

Current lead-free offerings include products with a 99.9% pure gold terminal finish. As dictated by market demand, Micross Components will offer a lead-free, flash-coated terminal finish consisting of a 400 micro-inch nickel base with a 4-8 micro-inch palladium gold finish.

Micross Components will continue to service existing designs that require lead finish with our standard 63/37% tin/lead solder finish and will provide this offering as long as there is an industry requirement.

In addition to lead-free initiatives, restrictions also include hexavalent chrome, mercury, cadmium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE). These hazardous substances are not part of the Micross Components manufacturing process.
Product Highlight

Copper Lead Frame SDRAM'S – 54 Pin TSOPII
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Copper Lead Frame SDRAM'S – 54 Pin TSOPII
Memory Cross Reference

To cross reference a memory part number, enter a competitor's part number here. This database includes crosses from White, Aeroflex, IDT, Pyramid and QP Semi.


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