Lead-Free Initiative

As a supplier to the military and aerospace industry worldwide, Austin Semiconductor acknowledges the current direction of the industry to transition into a lead-free manufacturing process in accordance with EU-Directive 2002/95/EG ("Restriction of Hazardous Substances"/ROHS).

Current lead-free offerings include products with a 99.9% pure gold terminal finish. As dictated by market demand, ASI will offer a lead-free, flash-coated terminal finish consisting of a 400 micro-inch nickel base with a 4-8 micro-inch palladium gold finish.

Austin Semiconductor will continue to service existing designs that require lead finish with our standard 63/37% tin/lead solder finish and will provide this offering as long as there is an industry requirement.

In addition to lead-free initiatives, restrictions also include hexavalent chrome, mercury, cadmium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE). These hazardous substances are not part of the Austin Semiconductor manufacturing process.