COTS / PEMS Products
Micross Components's long-term experience and knowledge in package design and test for the Hi-Reliability community has lead to the development and introduction of two plastic product families; our "COTS" (Commercial Off The Shelf) and our "iPEM" (integrated Plastic Encapsulated Microcircuit) devices. Both product groups are designed and rigorously tested with the Hi-Reliability socket/platform in mind, yet meeting or exceeding the guidelines of the Perry Initiative.
- SDRAM
- SDR: 64Mb, 128Mb, 256Mb, 512Mb, PC100 or PC133
- iPEM SDR: 1.2Gb
- iPEM DDR: 1.2Gb, 2.4Gb
- 25mm x 32mm 219 PBGA
- 16mm x 23mm 208 PBGA
- iPEM DDR2: 2.1Gb, 2.4Gb, 4.2Gb, 4.8Gb
- 25mm x 32mm 255 PBGA
- 16mm x 23mm 208 PBGA
- SRAM
- 256Kb to 16Mb, 10ns - 85ns, 5V and 3.3V
- Packaging: SOJ, TSOP
- Sync SRAM
- 4.0Mb to 18Mb, 100-250MHZ, 3.3V
- Pipeline, Flow-Trough and ZBL (no BL)
- Packaging: TQFP
- DRAM
- Non-Volatile
- FLASH & EEPROM
- 1Mb to 16Mb, 70ns - 120ns, 3V and 5V
- Packaging: TSOPI
- Standard and Low Power options available on most
- Packaging: PSOJ, TSOP, TQFP
LITERATURE:
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